 |
Your search returned 14 records. Click on the hyperlinks to view further details of Titles.. |
|
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
|
Year : 1997 Volume number : 20 Issue: 04 |
High-Speed Signal Transmission At The Front Of A Bookshelf Packaging System
(Article)
Subject:
Bookshelf Packaging System
,
Fpc Cable
,
Meander Migration
Author:
Shin'Ichi
Koike
Tohru
Kishimoto
page:
353
-
360
Long Lossy Lines (L3) And Their Impact Upon Large Chip Performance
(Article)
Subject:
High Clock Tate
,
Multichip Module
,
Submicron
Author:
Evan E.
Davidson
Bradley D.
Mccredie
Valter V.
Vilkelis
page:
361
-
375
Optimization Of High Pin Count Cavity Up Enhanced Plastic Ball Grid Array (Epbga) Packages For Robust Design
(Article)
Subject:
Design Of Experiments
,
Electronic Packaging
,
Stress Analysis
,
Taguchi
Author:
Atila
Mertol
page:
376
-
388
Physical Design And Assembly Process Development Of A Multichip Package Containing A Light Emitting Diode (Led) Array Die
(Article)
Subject:
Ball Grid Array
,
Flip-Chip
,
Glass Sealants
,
Multichip Module
Author:
N. Rao
Bonda
Treliant
Fang
Gordon
Tam
page:
389
-
395
Effect Of Au Thickness On Laser Beam Penetration In Semiconductor Laser Packages
(Article)
Subject:
Au Catalyst
,
Laser Welding
,
Optoelectronic
Author:
Wood-Hi
Cheng
Szu-Chun
Wang
Jao-Hwa
Kuang
page:
396
-
402
The Packagin Of Large Spot-Size Optoelectronic Devices
(Article)
Subject:
Fiber Array
,
Lasers
,
Mode Conversion Coefficients
,
Passive Dmfc
Author:
John V.
Collins
Phil J.
Fiddyment
Adrian R.
Thurlow
page:
403
-
408
Photonic Packagin Using Laser/Receiver Arrays And Flexible Optical Circuits
(Article)
Subject:
Flexible Launch Vehicle
,
Photonic Packaging
,
Laser Processing
Author:
Gary
Grimes
J. R.
Bortolini
W. K.
Honea
page:
409
-
415
Rheological Characterization Of Solder Pastes For Surface Mount Applications
(Article)
Subject:
Rheology
,
Solder Reliability
,
Surface Mount Technology
Author:
Venkata Giri
Kolli
Ruth
Anderson
page:
416
-
423
Analysis Of The Flow Of Encapasulant During Underfill Encapsulation Of Flip-Chips
(Article)
Subject:
Simulation
,
Dispensing
,
Flip-Chip
Author:
Sejin
Han
K. K.
Wang
page:
424
-
433
Study On The Pressurized Underfill Encapsulation Of Flip Chips
(Article)
Subject:
Encapsulant
,
Flip-Chip
,
Pressurized Flow
,
Underfill
Author:
Sejin
Han
K. K.
Wang
page:
434
-
442
Use Of Surface Insulation Resistance And Contact Angle Measurements To Characterize The Interactions Of Three Water Soluble Fluxes With Fr-4 Substrates
(Article)
Subject:
Conductive Adhesive
,
Water Soluble Polyester
,
Surface Integrity
Author:
Jenny A.
Jachim
Garth B.
Freeman
Laura J.
Turbini
page:
443
-
451
Soder Bump Size And Shape Modeling And Exprimental Validation
(Article)
Subject:
Capillarity
,
Flip-Chip
,
Solder Bump Radius
Author:
M. J.
Pfeifer
page:
452
-
457
Stress-Induced Parametric Shift In Plastic Packaged Devices
(Article)
Subject:
Nmos
,
Packaging
,
Pmosfets
,
Sensor
Author:
Hassn
Ali
page:
458
-
463
Effect Intermetallic Compounds On The Shear Fatigue Of Cu/63sn-37pb Solder Joints
(Article)
Subject:
Intermetallic
,
Reliability
,
Shear Failure
,
Smt
Author:
Y.C.
Chan
P, L,
Tu
J
Lai
page:
463
-
469
|
|
| | |
